substrate: 3.18mm 0.025mm [0.125" 0.001"] fr4/g10 or equivalent high temp material. 17m [1/2 oz.] cu clad. snpb plating. a1 solder ball: eutectic sn63pb37 1 2 1 2 threaded insert 3.18mm [0.125"] 0.30mm [0.012"] ? 0.40mm typ. [? 0.016"] 0.80mm typ. [0.031"] 2.54mm [0.100"] 12.725mm [0.501"] 7.20mm [0.283"] 17.725mm [0.698"] 3.14mm [0.124"] 2.50mm [0.098"] 7.20mm [0.283"] 5.08mm [0.200"] 2.76mm [0.109"] 2.50mm [0.098"] 17.725mm [0.698"] 12.725mm [0.501"] ? 0.60mm typ. [? 0.024"] side view top view description: b g a s u r f a c e m o u n t a d a p t o r 100 position surface mount land pattern to solder balls. to be used with ghz sockets. status: released drawing: h. hansen scale: 3:1 rev: b date: 8/14/02 modified: 4/12/05 file: SF-BGA100C-B-05 dwg SF-BGA100C-B-05 drawing ? 2002 ironwood electronics, inc. po box 21151 st. paul, mn 55121 tele: (651) 452-8100 www.ironwoodelectronics.com tolerances: diameters 0.03mm [0.001?], pcb perimeters 0.13mm [0.005?], pcb thicknesses 0.18mm [0.007"], pitches (from tru e position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005?] unless stated otherwise. materials and specifications are subject to change without notice.
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